Capabilities/Scanning Probe & Mechanical

Scanning Probe & Mechanical

Comprehensive surface characterization and mechanical testing services using atomic force microscopy, optical profilometry, spectroscopy, and nanomechanical testing platforms.

Atomic Force Microscopy (AFM)

Bruker Dimension Icon AFM

A very high-resolution scanning probe microscope producing three-dimensional surface images for nanoscale topography, nano-mechanical, and nano-electrical mapping.

Lateral Resolution< 1 nm
Vertical Resolution< 0.1 nm (z-noise)
Scan Range90 × 90 µm (XY); 10 µm (Z)
Sample SizeUp to 210 mm diameter

Bruker MultiMode 8 AFM

A versatile AFM platform supporting contact, tapping, and PeakForce Tapping modes for surface roughness, adhesion, stiffness, and electrical property mapping.

Lateral Resolution< 1 nm
Vertical Resolution< 0.05 nm
Scan Range15 × 15 µm (standard head)
ModesContact, tapping, PeakForce, cAFM, KPFM, MFM

Asylum Research MFP-3D AFM

A high-performance AFM with advanced modes including conductive AFM, Kelvin probe force microscopy, and magnetic force microscopy.

Lateral Resolution< 1 nm
Scan Range90 × 90 µm (XY); 40 µm (Z)
Sample SizeUp to 150 mm diameter
ModescAFM, KPFM, MFM, PFM, EFM

Surface Profilometry

KLA Zeta-20 Optical Profilometer

A fully integrated optical profiling microscope providing 3D metrology and imaging with multiple measurement modes.

Vertical Resolution< 1 nm (VSI mode)
Lateral Resolution0.4 µm (50× objective)
Measurement Range0.1 nm – 10 mm (vertical)
Sample SizeUp to 300 mm diameter

KLA-Tencor P-7 Surface Profilometer

A research-grade stylus profiler for surface metrology measuring depth, step height, roughness, and waviness.

Vertical Resolution0.1 Å (0.01 nm)
Scan LengthUp to 200 mm
Step Height Range5 nm – 1 mm
Stylus Force0.05–50 mg

Filmetrics F3 Film Thickness Spectral Reflectometer

Measures thin-film thickness and refractive index in under 3 seconds using spectral reflectometry.

Thickness Range2 nm – 70 µm
Wavelength Range380–1050 nm
Spot Size~ 1 mm (standard)
MaterialsSiO₂, SiNx, photoresist, polymers, metals

FMS Thin Film Stress Measurement System

Tests the stress of different films and substrates, and measures the coefficient of thermal expansion (CTE) of films.

Stress RangeMPa – GPa
Substrate Size25–150 mm wafers
Temperature RangeRoom temp – 500°C
MeasurementWafer bow / curvature (Stoney's equation)

Spectroscopy

Raman Spectroscopy with TERS

Tip-enhanced Raman spectroscopy combining AFM spatial resolution with Raman chemical sensitivity for nanoscale chemical mapping.

Spatial Resolution< 10 nm (TERS mode)
Laser Wavelengths405, 532, 633, 785 nm
Spectral Range50–4000 cm⁻¹
Materials2D materials, polymers, nanoparticles, bio samples

FTIR Microscopy

Fourier-transform infrared microscopy for chemical identification and mapping of organic and inorganic materials at the microscale.

Spectral Range400–4000 cm⁻¹ (mid-IR)
Spatial Resolution~ 10 µm (diffraction-limited)
ModesTransmission, reflection, ATR
Sample SizeBulk, thin films, particles ≥ 10 µm

Mechanical Testing

Nanoindentation Testing

Measures hardness, elastic modulus, creep, and fracture toughness of thin films and bulk materials at nanoscale contact depths.

Depth Resolution< 0.1 nm
Load Range1 µN – 500 mN
Hardness Range0.001–100 GPa
MaterialsMetals, ceramics, polymers, thin films

Keysight B1500A Semiconductor Device Analyzer

Provides wide-range electrical characterization of devices, materials, semiconductors, and active/passive components.

Voltage Range± 200 V
Current Range1 fA – 1 A
Frequency Range1 kHz – 5 MHz (C-V)
MeasurementsI-V, C-V, pulsed, impedance

Signatone Checkmate CM21X Probe Station

An ultra-stable 200/300 mm analytical probe station for electrical probing of fabricated devices.

Wafer SizeUp to 300 mm
Stage ResolutionSubmicron (fine movement)
Probe ArmsUp to 8 probes
Best ForMEMS, semiconductor, sensor characterization

Need Surface Characterization?

Contact us to discuss your surface analysis and mechanical testing requirements.