Capabilities/Electron Microscopy

Electron Microscopy

We provide a comprehensive suite of electron microscopy services, from routine SEM imaging to atomic-resolution aberration-corrected STEM/TEM, supporting the full range of your characterization needs.

Scanning Electron Microscopy (SEM)

Hitachi SU8700 cFEG SEM

An ultra-high resolution cold field emission SEM capable of sub-nanometer imaging. Ideal for high-resolution surface morphology and nanoparticle characterization.

Resolution0.6 nm @ 15 kV; 1.3 nm @ 1 kV

Accelerating Voltage0.1–30 kV

Sample SizeUp to 200 mm diameter

DetectorsSE, BSE, EDS

Hitachi SU8030 cFEG SEM

A cold field emission SEM offering high-resolution imaging at low accelerating voltages, minimizing beam damage on sensitive samples.

Resolution0.9 nm @ 15 kV; 1.6 nm @ 1 kV

Accelerating Voltage0.1–30 kV

Sample SizeUp to 150 mm diameter

Best ForPolymers, biological samples, beam-sensitive materials

JEOL JSM-7900FLV SEM

A field emission SEM with low-vacuum capability for imaging non-conductive and hydrated samples without coating.

Resolution0.7 nm @ 15 kV (high vacuum)

Vacuum ModesHigh vacuum & low vacuum (1–650 Pa)

Accelerating Voltage0.01–30 kV

DetectorsSE, BSE, EDS, EBSD, CL

FEI Quanta 650 ESEM

An environmental SEM capable of imaging wet, oily, or non-conductive samples in their natural state.

Resolution1.0 nm @ 30 kV (high vacuum)

Chamber PressureUp to 4000 Pa (ESEM mode)

Sample SizeUp to 150 mm diameter

DetectorsSE, BSE, EDS, GSED (wet mode)

Hitachi S-3400N-II SEM

A variable-pressure SEM for routine imaging of uncoated samples with EDS elemental mapping.

Resolution3.0 nm @ 25 kV (high vacuum)

Accelerating Voltage0.3–30 kV

Sample SizeUp to 200 mm diameter

DetectorsSE, BSE, EDS

FEI Quanta 650 FEG SEM with Nabity Pattern Generator

A variable-pressure FEG SEM capable of resolving features below 5 nm, equipped with NPGS for electron beam lithography.

Resolution< 5 nm (high vacuum)

EBL Min. Feature~ 20 nm (resist-dependent)

Accelerating Voltage200 V – 30 kV

DetectorsSE, BSE, EDS, EBSD + 8 total

Transmission Electron Microscopy (TEM)

JEOL ARM200CF Aberration-Corrected STEM/TEM

An aberration-corrected scanning/transmission electron microscope with sub-angstrom resolution for atomic-scale structural and chemical analysis.

Resolution (STEM)< 0.78 Å (HAADF)

Accelerating Voltage80 or 200 kV

Specimen Thickness< 100 nm (optimal)

AnalysisEDS, EELS, electron diffraction

FEI Tecnai G2 F30 STEM/TEM

A 300 kV FEG TEM/STEM with HAADF and BF detectors, EDS, and EELS for high-resolution imaging and elemental analysis.

Point Resolution2.0 Å (TEM)

Accelerating Voltage80–300 kV

Specimen Thickness< 100 nm (optimal)

AnalysisHAADF-STEM, EDS, EELS

Hitachi HD-2300 STEM

A dedicated STEM with dual EDS detectors for simultaneous elemental mapping of nanoparticles and thin-film cross-sections.

Resolution0.2 nm (STEM)

Accelerating Voltage80–200 kV

Specimen Thickness< 100 nm

DetectorsDual EDS, HAADF, BF/DF

Focused Ion Beam (FIB)

FEI Helios NanoLab 600i FIB-SEM

A dual-beam FIB-SEM for site-specific TEM sample preparation, 3D tomography, and nanoscale milling.

SEM Resolution0.9 nm @ 15 kV

FIB Resolution5 nm @ 30 kV (Ga⁺)

Min. Milling Feature~ 10 nm

Sample SizeUp to 100 mm diameter

FEI Nova NanoLab 600 FIB-SEM

A dual-beam system combining a high-resolution FEG-SEM with a focused Ga⁺ ion beam for cross-section preparation and 3D reconstruction.

SEM Resolution1.1 nm @ 15 kV

FIB Beam Current1 pA – 65 nA

GIS MaterialsPt, C, SiO₂ deposition; XeF₂ etch

Sample SizeUp to 100 mm diameter

Elemental Analysis

EDS / Elemental Mapping

Energy-dispersive X-ray spectroscopy available on multiple SEM and TEM platforms for qualitative and quantitative elemental analysis.

Detectable ElementsB (Z=5) to U (Z=92)

Spatial Resolution~ 1 µm (SEM); < 1 nm (TEM)

Detection Limit~ 0.1–1 wt% (matrix-dependent)

OutputPoint spectra, line scans, 2D maps

EELS / EFTEM

Electron energy-loss spectroscopy and energy-filtered TEM for chemical bonding analysis and elemental mapping at atomic resolution.

Energy Resolution< 0.1 eV (monochromated)

Detectable ElementsLi (Z=3) and above

Spatial ResolutionAtomic column (< 0.1 nm)

InformationOxidation state, bonding, band gap

Sample Preparation

EMS 1300 Critical Point Dryer

Used for drying delicate samples for SEM applications. Prevents collapse of fragile structures by avoiding the liquid-vapor interface.

ProcessSupercritical CO₂ drying

Compatible SolventsIPA, acetone (exchange with CO₂)

Best ForBiological samples, MEMS, nanostructures

Chamber Volume~ 1 L

Sputter Coater / Carbon Coater

Thin conductive coatings (Au/Pd, Pt, or carbon) applied to non-conductive samples to prevent charging during SEM imaging.

Coating MaterialsAu/Pd, Pt, Ir, carbon

Coating Thickness1–20 nm (tunable)

Best ForNon-conductive samples (polymers, ceramics, bio)

Sample SizeUp to 100 mm diameter stubs