Capabilities/Advanced Analysis

Advanced Analysis

Comprehensive advanced analytical services spanning X-ray diffraction, photoelectron spectroscopy, surface chemistry analysis, thermal characterization, and mass spectrometry.

X-Ray Analysis

X-Ray Diffraction (XRD)

Identifies crystalline phases, determines lattice parameters, and measures strain in thin films and bulk materials. Supports GIXRD for thin-film analysis and pole figure measurements for texture analysis.

2θ Range5°–165°
Angular Resolution0.001° (2θ)
Min. Film Thickness~ 5 nm (GIXRD)
MaterialsCrystalline metals, ceramics, semiconductors, polymers

X-Ray Photoelectron Spectroscopy (XPS)

A surface-sensitive technique for elemental composition, chemical state, and electronic state analysis of surfaces and thin films.

Sampling Depth1–10 nm
Detectable ElementsLi (Z=3) to U (Z=92)
Energy Resolution< 0.5 eV (FWHM)
Spot Size15 µm – 400 µm (adjustable)

Small-Angle X-Ray Scattering (SAXS)

Characterizes nanostructure, particle size, and morphology of soft materials, nanoparticles, and thin films in solution or bulk form.

q Range0.003–0.5 Å⁻¹ (1–200 nm length scale)
Sample FormsSolutions, gels, powders, thin films
Concentration0.1–50 mg/mL (solution)
Resolution1–100 nm structural features

Surface Chemistry

Auger Electron Spectroscopy (AES)

A surface-sensitive elemental analysis technique with high spatial resolution (~10 nm) for depth profiling and elemental mapping.

Spatial Resolution~ 10 nm (beam diameter)
Sampling Depth1–5 nm
Detectable ElementsLi (Z=3) to U (Z=92)
Depth Profile0–1 µm (with Ar⁺ sputtering)

Secondary Ion Mass Spectrometry (SIMS)

Provides depth profiling and trace element analysis of thin films and bulk materials with sub-ppm detection limits.

Detection Limit< 1 ppb (element-dependent)
Depth Resolution1–2 nm
Lateral Resolution~ 50 nm (NanoSIMS)
MaterialsSemiconductors, metals, polymers, biologicals

Rutherford Backscattering Spectrometry (RBS)

A non-destructive ion beam technique for quantitative elemental depth profiling of thin films without reference standards.

Depth Range0–2 µm (He⁺ beam)
Depth Resolution5–20 nm
Detectable ElementsAll elements (Z ≥ 6)
Accuracy± 1–5 at% (absolute, no standards needed)

Thermal & Electrical Analysis

Differential Scanning Calorimetry (DSC)

Measures heat flow associated with thermal transitions including melting, crystallization, glass transitions, and chemical reactions.

Temperature Range−90°C to 600°C
Heating Rate0.01–200°C/min
Sample Mass0.5–100 mg
Sensitivity± 0.1 µW

Thermogravimetric Analysis (TGA)

Measures mass changes as a function of temperature to characterize thermal stability, decomposition, and composition of materials.

Temperature RangeRoom temp – 1000°C
Heating Rate0.1–100°C/min
Mass Resolution0.1 µg
AtmospheresAir, N₂, Ar, O₂, custom gas mixtures

Keysight B1500A Semiconductor Device Analyzer

Provides wide-range electrical characterization of devices, materials, semiconductors, and active/passive components.

Voltage Range± 200 V
Current Range1 fA – 1 A
Frequency Range1 kHz – 5 MHz (C-V)
MeasurementsI-V, C-V, pulsed, impedance

Mass Spectrometry

Inductively Coupled Plasma Mass Spectrometry (ICP-MS)

Ultra-trace elemental analysis technique capable of detecting elements at parts-per-trillion concentrations.

Detection Limit0.001–0.1 ppb (element-dependent)
Detectable ElementsLi (Z=3) to U (Z=92)
Dynamic Range9 orders of magnitude
Sample FormAqueous solutions, acid digests

Matrix-Assisted Laser Desorption/Ionization (MALDI)

A soft ionization mass spectrometry technique for analyzing large biomolecules, polymers, and nanomaterials.

Mass Range100 Da – 1 MDa
Mass Accuracy< 50 ppm (external calibration)
Spatial Resolution~ 50 µm (MALDI imaging)
MaterialsProteins, polymers, lipids, nanomaterials

Need Advanced Analysis?

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